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Chipboard (wood + binder) represents a key structural solution for bracing, roofing and flooring, with outstanding mechanical properties in bending and transverse tension. Currently, 85% of particleboard products use formaldehyde-based adhesives (UF, PF, MUF), which are carcinogenic and harmful to the environment. From August 2026, a new European regulation (class E1/2) will impose a strict formaldehyde emission limit of less than 0.05 ppm (0.062 mg/m³), halving current thresholds.
Biobased alternatives to formaldehyde-based resins are limited. Lignin offers poor mechanical performance and low moisture resistance. Plant proteins, such as those derived from rapeseed, are water-sensitive and require complex processes to guarantee their effectiveness. Tannins, although promising, are limited by supply and processing constraints.
Développement de solutions adhésives biosourcées pour le collage de matériaux à base de bois (panneaux de particules )
Proposer une solution adhésive tout ou majoritairement biosourcée sans substance extrêmement polluante (SVHC free) à moindre émissions de composés organiques (COV) pour les panneaux à base de bois
FCBA, Critt Bois, CERMAV, LERMAB
